Computer-Reparatur-London

Doheem
  • Produiten
  • Via In Pad PCBs
    • 16 Layer ENIG Press Fit Lach PCB

      16 Layer ENIG Press Fit Lach PCB

      Schichten: 16

      Surface Finish: ENIG

      Basismaterial: FR4

      Dicke: 3,0 mm

      Min.Lach Duerchmiesser: 0,35 mm

      Gréisst: 420 × 560 mm

      baussenzege Layer W / S: 4/3mil

      Innenschicht W/S: 5/4mil

      Aspekt Verhältnis: 9:1

      Special Prozess: via-an-Pad, Impedanz Kontroll, Press fit Lach

    • 6 Layer ENIG FR4 Via-In-Pad PCB

      6 Layer ENIG FR4 Via-In-Pad PCB

      Schichten: 6

      Surface Finish: ENIG

      Basismaterial: FR4

      baussenzege Layer W / S: 4 / 3.5mil

      Innenschicht W/S: 4/3.5mil

      Dicke: 2,0 mm

      Min.Lach Duerchmiesser: 0,25 mm

      Speziell Prozess: via-an-Pad, Impedanz Kontroll

    • 6 Layer ENIG FR4 Via-In-Pad PCB

      6 Layer ENIG FR4 Via-In-Pad PCB

      Schichten: 6

      Surface Finish: ENIG

      Basismaterial: FR4

      W/S: 5/4 mil

      Dicke: 1,0 mm

      Min.Lach Duerchmiesser: 0,2 mm

      Special Prozess: via-an-Pad

    • 6 Layer ENIG Via-In-Pad PCB

      6 Layer ENIG Via-In-Pad PCB

      Schichten: 6

      Surface Finish: ENIG

      Basismaterial: FR4

      baussenzege Layer W / S: 7 / 3.5mil

      Innenschicht W/S: 7/4mil

      Dicke: 0,8 mm

      Min.Lach Duerchmiesser: 0,2 mm

      Special Prozess: via-an-Pad

    • 8 Layer ENIG FR4 Via-In-Pad PCB

      8 Layer ENIG FR4 Via-In-Pad PCB

      Schichten: 8

      Surface Finish: ENIG

      Basismaterial: FR4

      baussenzege Layer W / S: 4.5 / 3.5mil

      Innenschicht W/S: 4,5/3,5mil

      Dicke: 1,2 mm

      Min.Lach Duerchmiesser: 0,15 mm

      Special Prozess: via-an-Pad

    • 6 Layer FR4 ENIG Via An Pad PCB

      6 Layer FR4 ENIG Via An Pad PCB

      Schichten: 6

      Surface Finish: ENIG

      Basismaterial: FR4

      baussenzege Layer W / S: 4 / 3.5mil

      Innenschicht W/S: 4,5/3,5mil

      Dicke: 1,0 mm

      Min.Lach Duerchmiesser: 0,2 mm

      Besonnesch Prozess: via am Pad

    • 8 Layer ENIG FR4 Via-In-Pad PCB

      8 Layer ENIG FR4 Via-In-Pad PCB

      Schichten: 8

      Surface Finish: ENIG

      Basismaterial: FR4

      baussenzege Layer W / S: 4 / 3.5mil

      Innenschicht W/S: 4/3.5mil

      Dicke: 1,0 mm

      Min.Lach Duerchmiesser: 0,2 mm

      Speziell Prozess: via-an-Pad, Impedanz Kontroll

    • 10 Layer ENIG FR4 Via An Pad PCB

      10 Layer ENIG FR4 Via An Pad PCB

      Layer: 10
      Surface Finish: ENIG
      Material: FR4 Tg170
      Bausselinn W / S: 10/7.5mil
      Bannen Linn W / S: 3,5 / 7mil
      Board deck: 2,0 mm
      Min.Lach Duerchmiesser: 0,15 mm
      Plug Lach: iwwer Fëllung plating